Polishing particle and method for producing polishing particle

Details Polishing particle and method for producing polishing particle Polishing particle and method for producing polishing particle

2006-05-02

2006-05-02

Lorengo, J. A. (Department: 1755)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000

Reexamination Certificate

active

07037352

ABSTRACT:
By providing an abrasive having a ratio of volume-cumulative (95%) average particle size (D95) to volume-cumulative (50%) average particle size (D50) (D95/D50) falling within a range of 1.2 to 3.0 or an abrasive having a volume-cumulative (95%) average particle size (D95) falling within a range of 0.1-1.5 μm and containing coarse particles having a size more than 10 times the volume-cumulative (50%) average particle size (D50) in an amount, based on the total mass of all the particles, of 1 mass % or less, there can be provided an abrasive, an abrasive slurry, a method for producing an abrasive, and a polishing method which attain, during accurate polishing of substrates such as electronics substrates, a high removal rate and a high-quality surface; i.e., a surface having a high flatness, low surface roughness, and substantially no microscratches or micropits.

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Patent Abstracts of Japan, abstracting JP 2001-323254, Nov. 22, 2001.
Patent Abstracts of Japan, abstracting JP 2001-062705, Mar. 13, 2001.

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