Polishing pads useful in chemical mechanical polishing of...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S042000, C451S287000, C451S296000, C051S294000, C051S302000

Reexamination Certificate

active

06890244

ABSTRACT:
A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.

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