Polishing pads for a semiconductor substrate

Details Polishing pads for a semiconductor substrate Polishing pads for a semiconductor substrate

1998-07-10

2000-10-03

Scherbel, David A.

Abrading

Flexible-member tool, per se

51283, B24D 722

Patent

active

061265322

ABSTRACT:
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pores of the porous substrate have an average pore diameter of from about 5 to about 100 microns which enhances pad polishing performance.

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