Coating processes – Solid particles or fibers applied – Applying superposed diverse coatings or coating a coated base
Reexamination Certificate
2005-05-10
2005-05-10
Chen, Bret (Department: 1762)
Coating processes
Solid particles or fibers applied
Applying superposed diverse coatings or coating a coated base
C427S419100, C051S295000, C051S309000
Reexamination Certificate
active
06890591
ABSTRACT:
Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the pattern elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.
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Definition of “resin” from Merriam-Webster's Collegiate Dictionary, 10th Edition, © 1999 by Merriam-Webster, Inc., p. 996.*
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Agarwal Vishnu K.
Meikle Scott G.
Chen Bret
Dorsey & Whitney LLP
Fletcher, III William Phillip
Micro)n Technology, Inc.
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