Polishing pads and methods relating thereto

Abrading – Rigid tool – Rotary disk

Reexamination Certificate

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Details

C451S041000, C451S298000, C451S409000, C451S533000, 36, C216S052000

Reexamination Certificate

active

06843712

ABSTRACT:
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

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