Polishing pads

Details Polishing pads Polishing pads

1995-08-21

1997-02-25

Cannon, James C.

Stock material or miscellaneous articles

Surface property or characteristic of web, sheet or block

51298, 36447406, 437225, 451 41, 451527, 451533, 216 52, B24B 100, B24B 360, B24B 2900, B32B 3300

Patent

active

056057601

ABSTRACT:
A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.

REFERENCES:
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5240552 (1993-08-01), Yu et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5489233 (1996-02-01), Cook et al.

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