Polishing pad with uniform abrasion

Details Polishing pad with uniform abrasion Polishing pad with uniform abrasion

1990-08-03

1991-06-04

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51209R, 51DIG34, 511313, 51395, B24B 722

Patent

active

050202839

ABSTRACT:
A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece.

REFERENCES:
patent: 2409953 (1946-10-01), Posh
patent: 3495362 (1970-02-01), Hillenbrand
patent: 3517466 (1970-01-01), Bouvier
patent: 4663890 (1987-05-01), Brandt

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