Polishing pad with radially extending tapered channels

Details Polishing pad with radially extending tapered channels Polishing pad with radially extending tapered channels

1996-09-06

1997-07-08

Smith, James G.

Abrading

Abrading process

Glass or stone abrading

451527, 451283, 451287, B24B 100

Patent

active

056454694

ABSTRACT:
A polishing pad having a polishing surface with radially extending tapered channels is disclosed. The polishing surface includes an inner radius within an outer radius, and the channels extend from the inner radius to the outer radius. Preferably, the outer radius is spaced from an outer circumferential edge of the polishing surface, the inner radius is an inner circumferential edge of the polishing surface, and the channels taper laterally and vertically at the outer radius. The channels are dimensioned and configured to direct slurry from the inner radius to the outer radius. The channels can be shaped with opposing sidewalls that are parallel in a first portion and diagonally converge in a second portion to form a sunburst pattern, or alternatively, with opposing sidewalls that continuously curve in a first rotational direction to form a starfish pattern. A polishing method includes positioning a wafer over the outer radius while introducing a slurry to facilitate polishing the wafer, and positioning the wafer inside the outer radius while introducing a cleaning fluid to facilitate cleaning the wafer.

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