Polishing pad with oscillating path groove network

Details Polishing pad with oscillating path groove network Polishing pad with oscillating path groove network

2007-09-18

2007-09-18

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S059000, C451S063000, C451S527000, C451S550000

Reexamination Certificate

active

10855537

ABSTRACT:
A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may extend substantially radially outwardly and an oscillating portion (74) that begins at a transition point (76) and is configured to slow the radially outward flow of the polishing medium.

REFERENCES:
patent: 5645469 (1997-07-01), Burke et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 6093651 (2000-07-01), Andideh et al.
patent: 6120366 (2000-09-01), Lin et al.
patent: 6159088 (2000-12-01), Nakajima et al.
patent: 6165904 (2000-12-01), Kim et al.
patent: 6241596 (2001-06-01), Osterheld et al.
patent: 6273806 (2001-08-01), Bennett et al.
patent: 6685548 (2004-02-01), Chen et al.
patent: 6958002 (2005-10-01), Palaparthi
patent: 2001/0044263 (2001-11-01), Andideh et al.
patent: H08-011051 (1996-01-01), None

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