Polishing pad with oriented pore structure

Details Polishing pad with oriented pore structure Polishing pad with oriented pore structure

2006-02-14

2006-02-14

Pyon, Harold (Department: 1772)

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

C428S423100, C428S425100, C428S304400, C428S338000, C428S220000, C428S152000, C051S296000, C051S298000, C051S303000, C451S527000, C451S530000

Reexamination Certificate

active

06998166

ABSTRACT:
The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.

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patent: WO 98/28108 (1997-07-01), None
patent: WO 03/012846 (2003-02-01), None

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