Polishing pad with grooves to retain slurry on the pad texture

Abrading – Flexible-member tool – per se

Reexamination Certificate

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Details

C451S527000, C451S287000

Reexamination Certificate

active

11700346

ABSTRACT:
A rotational chemical mechanical polishing pad designed for use with a polishing medium. The polishing pad includes a polishing layer having a polishing surface containing a plurality of grooves. At least a portion of each of the plurality of grooves has a shape and orientation determined as a function of the trajectory of the polishing medium during use of the pad.

REFERENCES:
patent: 6241596 (2001-06-01), Osterheld et al.
patent: 6783436 (2004-08-01), Muldowney
patent: 6843709 (2005-01-01), Crkvenac et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 6955587 (2005-10-01), Muldowney
patent: 7059949 (2006-06-01), Elmufdi et al.
patent: 7059950 (2006-06-01), Muldowney
patent: 7108597 (2006-09-01), Muldowney
patent: 7125318 (2006-10-01), Muldowney
patent: 7131895 (2006-11-01), Elmufdi et al.
patent: 7234224 (2007-06-01), Naugler et al.
patent: 2007/0032182 (2007-02-01), Suzuki
patent: 2007/0066195 (2007-03-01), Duong

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