Polishing pad with flow modifying groove network

Details Polishing pad with flow modifying groove network Polishing pad with flow modifying groove network

2007-01-02

2007-01-02

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S527000

Reexamination Certificate

active

11146664

ABSTRACT:
A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium (46) with structure on the wafer. The groove network has a first portion (72) that may extend substantially radially outward and a second portion (74) that is configured to vary the speed of the radially outward flow of the polishing medium.

REFERENCES:
patent: 2005/0106878 (2005-05-01), Muldowney
patent: 2005/0107009 (2005-05-01), Muldowney
patent: H08-011051 (1996-01-01), None

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