Polishing pad used for polishing silicon wafers and polishing me

Details Polishing pad used for polishing silicon wafers and polishing me Polishing pad used for polishing silicon wafers and polishing me

1995-05-31

1998-10-27

Nguyen, Nam

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 88, 216 89, 438690, 438691, 438692, 438693, C23F 102

Patent

active

058273956

ABSTRACT:
A polishing pad composed of a rigid polyurethane added with CaCO.sub.3 particles is able to provide polished wafers having a surface roughness which is comparable to that attained by the conventional final polishing process. Even when polishing is achieved under a high load condition to improve the productivity, the polished wafers are free from deformation, such as concaving, and have an excellent flatness.

REFERENCES:
patent: 4382803 (1983-05-01), Allard
patent: 4466218 (1984-08-01), Ottman et al.
patent: 4893439 (1990-01-01), McAvoy et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
European Search Report Jun. 10, 1995.

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