Polishing pad resistant to delamination

Details Polishing pad resistant to delamination Polishing pad resistant to delamination

2005-01-04

2005-01-04

Seidleck, James J. (Department: 1711)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550AC, C428S353000, C428S447000, C428S451000, C428S483000, C156S306600, C156S329000

Reexamination Certificate

active

06838169

ABSTRACT:
The present invention provides, chemical mechanical polishing pad with improved polishing properties and longevity for polishing semiconductor wafers. The polishing pad comprises a thermoplastic backing film and a pressure sensitive adhesive coupled to the thermoplastic backing film. The pressure sensitive adhesive is configured to couple a chemical mechanical polishing pad to a polishing platen. The pressure sensitive adhesive is further configured to provide an interface capable of substantially preventing delamination of the polishing pad from the polishing platen for at least about 4 days exposure to a polishing slurry medium having a pH of about 4 or higher.

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