Polishing pad, polishing apparatus and polishing method

Details Polishing pad, polishing apparatus and polishing method Polishing pad, polishing apparatus and polishing method

1999-01-29

2000-12-12

Hail, III, Joseph J.

Abrading

Flexible-member tool, per se

Interrupted or composite work face

451550, 451551, B24D 1100

Patent

active

061590886

ABSTRACT:
A polishing pad for chemical mechanical polishing capable of simultaneously realizing a reduction of process costs by the reduction of the amount of usage of a polishing slurry and an improvement of a polishing quality of a wafer surface, and a polishing apparatus and a polishing method using the same, provided with a first area A at a side of a predetermined radial line R of the polishing pad in the direction of rotation or advance 30 of the polishing pad, a second area B at an opposite side thereof, and grooves having projecting portions 203 in a direction opposite to the direction of rotation or advance 30 of the polishing pad formed only in the second area B.

REFERENCES:
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5650039 (1997-07-01), Talieh
patent: 5690540 (1997-11-01), Elliott et al.
patent: 5778481 (1998-07-01), Amsden et al.
patent: 5882251 (1999-03-01), Berman et al.
patent: 5899799 (1999-05-01), Tjaden et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5984769 (1999-11-01), Bennett et al.

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