Bleaching and dyeing; fluid treatment and chemical modification – Pattern effect dyeing – process – compositions – or products – Two or more sequential dye application steps
Patent
1999-04-20
2000-10-24
Einsmann, Margaret
Bleaching and dyeing; fluid treatment and chemical modification
Pattern effect dyeing, process, compositions, or products
Two or more sequential dye application steps
8494, 8506, 8515, 8522, 8478, 216 84, 216 89, 451 8, D06P 500, D06P 324, D06P 380, D06P 387, B24B 100
Patent
active
061360430
ABSTRACT:
The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a limited depth that does not cause total coloring. Another embodiment of the present invention involves a fixed abrasive pad that has fixed abrasives embedded into the pad to a selected depth where at least one color level is within the portion of the pad that contains the fixed abrasives. After dyeing the pad, the pad is attached to the polishing platen. During the polishing operation, a color change signals a time to stop the polishing operation and change the pad. With multiple colors in the pad, limited only by the ability to dye the pad with uniform depth levels, characteristic wear patterns can be observed and adjustments made accordingly to prolong and optimize pad life. A pad having voids and optional abrasives incorporated therein is also disclosed. The contents of each void facilitates the detection of the degree to which the polishing pad has been worn during a polishing operation. Substances may be stored within voids that are released by the breach of the voids caused abrasion during the polishing operation. Visual or audible diagnostics resulting from the breaching of voids are useful to control the polishing operation and thus increase yield.
REFERENCES:
patent: 4019289 (1977-04-01), Korver
patent: 5144773 (1992-09-01), Flores et al.
patent: 5439551 (1995-08-01), Meikle et al.
patent: 5483568 (1996-01-01), Yano et al.
patent: 5733176 (1998-03-01), Robinson et al.
patent: 5736427 (1998-04-01), Henderson
patent: 5913713 (1999-06-01), Cheek et al.
Robinson Karl M.
Skrovan John K.
Walker Michael A.
Einsmann Margaret
Micro)n Technology, Inc.
LandOfFree
Polishing pad methods of manufacture and use does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing pad methods of manufacture and use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad methods of manufacture and use will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1959332