Polishing pad, method of producing same and method of polishing

Details Polishing pad, method of producing same and method of polishing Polishing pad, method of producing same and method of polishing

2007-07-10

2007-07-10

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S307000, C451S533000, C051S298000

Reexamination Certificate

active

11518065

ABSTRACT:
A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.

REFERENCES:
patent: 6069080 (2000-05-01), James et al.
patent: 6080671 (2000-06-01), Crevasse et al.
patent: 6095902 (2000-08-01), Reinhardt
patent: 6328634 (2001-12-01), Shen et al.
patent: 6425816 (2002-07-01), Roberts et al.
patent: 6843712 (2005-01-01), Roberts et al.
patent: 2005/0136805 (2005-06-01), Suzuki et al.

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