Polishing pad having slurry utilization enhancing grooves

Details Polishing pad having slurry utilization enhancing grooves Polishing pad having slurry utilization enhancing grooves

2006-03-28

2006-03-28

Nguyen, George (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S282000, C451S921000, C451S527000, C451S534000

Reexamination Certificate

active

07018274

ABSTRACT:
A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the grooves contain a slurry (236) that facilitates polishing. Each groove includes a plurality of mixing structures (220) configured to cause mixing of slurry located in a lower portion (240) of the groove with slurry located in the upper portion (244) of the groove.

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