Polishing pad having grooves configured to promote mixing...

Details Polishing pad having grooves configured to promote mixing... Polishing pad having grooves configured to promote mixing...

2006-09-19

2006-09-19

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S921000

Reexamination Certificate

active

07108597

ABSTRACT:
A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors (V1–V4)(V1′–V4′)(V1″–V4″) (V1′″–V4′″) of the wafer. These parallel orientations promote the formation of mixing wakes in a polishing medium (120) within these grooves during polishing.

REFERENCES:
patent: 5690540 (1997-11-01), Elliott et al.
patent: 6685548 (2004-02-01), Chen et al.
patent: 6783436 (2004-08-01), Muldowney
patent: 6843709 (2005-01-01), Crkvenac et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 6955587 (2005-10-01), Muldowney
patent: 6974372 (2005-12-01), Muldowney
patent: 2002/0068516 (2002-06-01), Chen et al.
patent: WO03/017348 (2003-02-01), None

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