Polishing pad having grooves configured to promote mixing...

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Reexamination Certificate

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Details

C451S921000

Reexamination Certificate

active

06974372

ABSTRACT:
A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors (V1–V4)(V1′–V4′)(V1″–V4″)(V1′″–V4′″) of the wafer. These parallel orientations promote the formation of mixing wakes in a polishing medium (120) within these grooves during polishing.

REFERENCES:
patent: 5690540 (1997-11-01), Elliott et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5990012 (1999-11-01), Robinson et al.
patent: 6159088 (2000-12-01), Nakajima
patent: 6273806 (2001-08-01), Bennett et al.
patent: 6315857 (2001-11-01), Cheng et al.
patent: 6354919 (2002-03-01), Chopra
patent: 6520847 (2003-02-01), Osterheld et al.
patent: 6685548 (2004-02-01), Chen et al.
patent: 6783436 (2004-08-01), Muldowney
patent: 6843709 (2005-01-01), Crkvenac et al.
patent: 6843711 (2005-01-01), Muldowney
patent: 2002-0022198 (2002-03-01), None

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