Abrading – Flexible-member tool – per se
Reexamination Certificate
2001-02-02
2004-01-20
Rose, Robert A. (Department: 3723)
Abrading
Flexible-member tool, per se
C051S298000
Reexamination Certificate
active
06679769
ABSTRACT:
This invention relates to polishing pads and a method for making a polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface by machining to create an advantageous micro-texture. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.
U.S. Pat. No. 5,749,772 describes conditioning a pad using a temperature-controlled conditioning disc to enable uniform chemical mechanical polishing (CMP) at a stable temperature.
U.S. Pat. No. 5,569,062 describes a cutting means for abrading the surface of a polishing pad during polishing. U.S. Pat. No. 5,081,051 describes an elongated blade having a serrated edge pressing against a pad surface thereby cutting circumferential grooves into the pad surface.
U.S. Pat. No. 5,990,010 describes a preconditioning mechanism or apparatus for preconditioning a polishing pad. This apparatus is used to generate and re-generate micro-texture during polishing pad use.
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Stein, David; Hetherington, Dale; Dugger, Mike; Stout, Tom, “Optical Interferometry for Surface Measurements of CMP Pads”, Journal of Electronic Materials, vol. 25, No. 10, Oct. 1996, pp. 1623-1627.
Kulp Mary Jo
Naugler Steven
Pinheiro Barry Scott
Biederman Blake T.
Kita Gerald K.
Oh Edwin
Rodel Holdings, INC
Rose Robert A.
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