Polishing pad having a window with reduced surface roughness

Details Polishing pad having a window with reduced surface roughness Polishing pad having a window with reduced surface roughness

2007-01-30

2007-01-30

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S056000, C451S528000

Reexamination Certificate

active

11492443

ABSTRACT:
The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.

REFERENCES:
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patent: 6280290 (2001-08-01), Birang et al.
patent: 6866559 (2005-03-01), Lehman et al.
patent: 6884146 (2005-04-01), Lehman et al.
patent: 6935922 (2005-08-01), Lehman et al.
patent: 7030018 (2006-04-01), Lehman et al.
patent: 2003/0181131 (2003-09-01), Lehman et al.

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