Polishing pad for semiconductor wafers

Details Polishing pad for semiconductor wafers Polishing pad for semiconductor wafers

1989-01-25

1990-09-04

Rose, Robert A.

Abrasive tool making process, material, or composition

Pore forming

511314, 51283R, 51298, 51406, 51DIG34, 156636, B24D 332, H01L 21306

Patent

active

049541412

ABSTRACT:
A polishing pad for a semiconductor wafer, which pad is made of a foamed fluorine-contained resin sheet and is highly resistant to a corrosive polishing solution such as bromine-methanol system or bromine-methanol-silica powder system.

REFERENCES:
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 3857123 (1974-12-01), Walsh
patent: 4720941 (1988-01-01), Belieff et al.
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4842678 (1989-06-01), Noro et al.

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