Polishing pad for semiconductor wafer and method for polishing s

Details Polishing pad for semiconductor wafer and method for polishing s Polishing pad for semiconductor wafer and method for polishing s

1999-04-05

2000-08-08

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 59, 451527, 451533, 451550, B24B 100, B24D 1100

Patent

active

060993901

ABSTRACT:
A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.

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patent: 5609517 (1997-03-01), Lofaro
patent: 5910471 (1999-06-01), Christianson et al.

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