Polishing pad for planarization

Details Polishing pad for planarization Polishing pad for planarization

2005-06-14

2005-06-14

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Laminate

C451S526000, C451S451000, C451S028000

Reexamination Certificate

active

06905402

ABSTRACT:
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.

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ASTM D 1622-88 “Standard Test Method for Apparent Density of Rigid Cellular Plastics”.
ASTM D 2240-91 “Standard Test Method for Rubber Property-Durometer Hardness”.
ASTM D 4284-88 “Standard Test Method for Determining Pore Volume Distribution of Catalysts by Mercury Intrusion Porosimetry”.
U.S. Appl. No. 09/882,548, filed Jun. 14, 2001 “A Silica-Based Slurry”, 6,656,241.

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