Polishing pad for planarization

Details Polishing pad for planarization Polishing pad for planarization

1991-09-30

1993-03-30

Dixon, Jr., William R.

Abrasive tool making process, material, or composition

With synthetic resin

51307, 51308, 51309, C09K 314

Patent

active

051979993

ABSTRACT:
A pad for planarization by mechanical polishing of a dielectric layer formed over features on a wafer in the manufacture of semiconductor devices has a substantially planar polishing face. The pad includes a soft matrix material and a substance for stiffening distributed in the pad so as to effect stiffening of the pad. The substance for stiffening is composed of a hard substance, which in a preferred embodiment is in the form of discrete particles distributed substantially uniformly throughout substantially all of the pad.

REFERENCES:
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patent: 4189395 (1980-02-01), Bland
patent: 4221572 (1980-09-01), Torimae et al.
patent: 4243842 (1981-01-01), Yancey
patent: 4481126 (1984-11-01), Trinh et al.
patent: 4609380 (1986-09-01), Barnett et al.
patent: 4720941 (1988-01-01), Belieff et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4954141 (1990-09-01), Takiyama et al.

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