Polishing pad for electrochemical mechanical polishing

Details Polishing pad for electrochemical mechanical polishing Polishing pad for electrochemical mechanical polishing

2004-05-25

2009-11-17

King, Roy (Department: 1793)

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

With mechanical abrasion or grinding

Reexamination Certificate

active

07618529

ABSTRACT:
The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.

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