Polishing pad for chemical-mechanical polishing of a semiconduct

Details Polishing pad for chemical-mechanical polishing of a semiconduct Polishing pad for chemical-mechanical polishing of a semiconduct

1995-05-19

1998-06-23

Rose, Robert A.

Abrading

Flexible-member tool, per se

Interrupted or composite work face

451 41, 451921, 451289, B24B 100

Patent

active

057696993

ABSTRACT:
The present invention includes a polishing pad to improve polishing uniformity across a semiconductor substrate and a method using the polishing pad. The polishing pad has a first region that is closer to the edge of the polishing pad and a second region adjacent to the first region and further from the edge of the polishing pad. The polishing pad is configured, so that the second region is thicker or less compressible compared to the first region. The polishing pad should not require significantly changing any of the equipment. Oscillating range and possibly polishing pressure may need to be changed when one of the polishing pads of the present invention is used. Other operational parameters are not expected to be substantially different from a conventional polishing pad, although slight optimization of the other operating parameters may be needed.

REFERENCES:
patent: 3499250 (1970-03-01), Jensen et al.
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 3857123 (1974-12-01), Walsh
patent: 4313284 (1982-02-01), Walsh
patent: 4450652 (1984-05-01), Walsh
patent: 4511605 (1985-04-01), McCartney
patent: 4613345 (1986-09-01), Thicke et al.
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5173441 (1992-12-01), Yu et al.
patent: 5216843 (1993-06-01), Breivogel et al.
Disclosed anonymously; "Pad Conditionong to Control Radial Uniformity of Mechanical Polishing"; Disclosure No. 32227; Feb. 1991.

Affiliated with

Also associated with

Rating

Polishing pad for chemical-mechanical polishing of a semiconduct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing pad for chemical-mechanical polishing of a semiconduct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad for chemical-mechanical polishing of a semiconduct will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1389139