Polishing pad for chemical-mechanical polishing of a semiconduct

Details Polishing pad for chemical-mechanical polishing of a semiconduct Polishing pad for chemical-mechanical polishing of a semiconduct

1995-05-18

1997-05-13

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

51293, 438693, H01L 21461

Patent

active

056288620

ABSTRACT:
A mold is used to form a polishing pad, wherein the surface of the polishing side of the polishing pad is determined by a primary surface of the mold. Features along the polishing side of a polishing pad may take any one of several different shapes. Channels along the polishing side of the polishing pad allow a smaller pore size to be used. The mold allows more control over the surface of the polishing side, which in turn give more control over polishing characteristics.

REFERENCES:
patent: 4435247 (1984-03-01), Basi
patent: 4613345 (1986-09-01), Thicke et al.
patent: 4821461 (1989-04-01), Holmstrand
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 5015266 (1991-05-01), Yamamoto
patent: 5020283 (1991-06-01), Tuttle
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5081051 (1992-01-01), Mattingly
patent: 5096464 (1992-03-01), Yamamoto
patent: 5177908 (1993-01-01), Tuttle
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5219462 (1993-06-01), Bruxvoort et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5302233 (1994-04-01), Kim et al.
patent: 5329734 (1994-07-01), Yu
patent: 5399234 (1995-03-01), Yu et al.
Yu, et al.; U.S. application No. 08/077,265; Filed on Jun. 17, 1993.
Yu; U.S. application No. 08/054,167; filed on Apr. 30, 1993.

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