Polishing pad for chemical-mechanical planarization of a semicon

Details Polishing pad for chemical-mechanical planarization of a semicon Polishing pad for chemical-mechanical planarization of a semicon

1996-08-20

1998-04-14

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451285, 451 66, B24B 100

Patent

active

057385670

ABSTRACT:
The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.

REFERENCES:
patent: 4961243 (1990-10-01), Barber
patent: 4998314 (1991-03-01), Borofsky
patent: 5142727 (1992-09-01), Koester
patent: 5377378 (1995-01-01), Cutler
patent: 5578529 (1996-11-01), Mullins
patent: 5616069 (1997-04-01), Walker et al.

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