Polishing pad for a semiconductor substrate

Details Polishing pad for a semiconductor substrate Polishing pad for a semiconductor substrate

1998-04-17

2000-05-16

Scherbel, David A.

Abrading

Flexible-member tool, per se

451527, B24D 722

Patent

active

060629681

ABSTRACT:
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage.

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