Polishing pad for a semiconductor substrate

Details Polishing pad for a semiconductor substrate Polishing pad for a semiconductor substrate

1998-07-10

2000-09-12

Eley, Timothy V.

Abrading

Flexible-member tool, per se

451534, 451539, B24D 1100

Patent

active

061170003

ABSTRACT:
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanically buffed to improve the adhesion of an adhesive to the pad bottom surface.

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