Polishing pad for a semiconductor device having a...

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Reexamination Certificate

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Details

C451S530000

Reexamination Certificate

active

06899611

ABSTRACT:
A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.

REFERENCES:
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patent: 3959935 (1976-06-01), Stoppacher
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patent: 4576612 (1986-03-01), Shukla et al.
patent: 4581287 (1986-04-01), Smith et al.
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patent: 5000761 (1991-03-01), Mayton et al.
patent: 5078753 (1992-01-01), Broberg et al.
patent: 5197999 (1993-03-01), Thomas
patent: 5269821 (1993-12-01), Helmin et al.
patent: 0 388 718 (1990-09-01), None
patent: 59-129668 (1984-07-01), None
patent: 02-036066 (1990-02-01), None
patent: 05-146969 (1993-06-01), None
Kenkyusha's New English-Japanese Dictionary of Bilinqual Principles, Tokyo, Japan, p. 1807.

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