Polishing pad design

Details Polishing pad design Polishing pad design

2005-05-03

2005-05-03

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

C451S054000, C451S041000

Reexamination Certificate

active

06887131

ABSTRACT:
A method is provided for creating a polish pad. This may involve determining a design layout of a wafer. The design layout may include a distribution of metal line features on the wafer. A polish pad design may be created/determined based on the determined layer. The polish pad may have asperities having a width greater than a width of metal line features of the wafer.

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