Polishing pad containing interpenetrating liquified vinyl...

Abrasive tool making process – material – or composition – With synthetic resin

Reexamination Certificate

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Details

C451S526000

Reexamination Certificate

active

07833297

ABSTRACT:
Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.

REFERENCES:
patent: 4927432 (1990-05-01), Budinger et al.
patent: 5209760 (1993-05-01), Wiand
patent: 1 108 500 (2001-06-01), None
patent: 2000218551 (2000-08-01), None
patent: 2001198796 (2001-07-01), None
patent: 2001239453 (2001-09-01), None
patent: 2001239454 (2001-09-01), None
patent: 2000071168 (2003-03-01), None
patent: 2005059179 (2005-03-01), None
patent: WO 94/04599 (1994-03-01), None

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