Polishing pad conditioning system and method

Details Polishing pad conditioning system and method Polishing pad conditioning system and method

1997-08-05

1998-12-22

Rose, Robert A.

Abrading

Abrading process

With tool treating or forming

451443, B24B 5300

Patent

active

058511385

ABSTRACT:
A system and method for conditioning a polishing pad.sup.12 in a chemical-mechanical polishing process for polishing a semiconductor wafer. The conditioning system includes a conditioning device 20 into which a plurality of removable inserts 24 are inserted. The inserts each have a tip 26 comprising a conditioning material. During operation, the plurality of insert tips 26 contact the polishing pad 12 to condition the polishing pad 12, thereby enhancing the uniformity of wafers polished by the polishing pad and reducing damage to polished wafers.

REFERENCES:
patent: 4743144 (1988-05-01), Shikata
patent: 5188489 (1993-02-01), Santhanam et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5569062 (1996-10-01), Karlsrud
patent: 5626509 (1997-05-01), Hayashi

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