Polishing pad conditioning disks for chemical mechanical...

Details Polishing pad conditioning disks for chemical mechanical... Polishing pad conditioning disks for chemical mechanical...

2005-03-29

2005-03-29

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000

Reexamination Certificate

active

06872127

ABSTRACT:
The invention relates to disks for conditioning pads used in the chemical mechanical polishing of semiconductor wafers, and a method of fabricating the pads. In one embodiment, the conditioning pad includes multiple, pyramid-shaped, truncated protrusions which are cut or shaped in the surface of a typically stainless steel substrate. Each of the truncated protrusions includes a plateau in the top thereof. A seed layer, typically titanium nitride (TiN), is provided on the surface of the protrusions, and a contact layer such as diamond-like carbon (DLC) or other suitable film is provided over the seed layer. In another embodiment, each of the protrusions is pyramid-shaped and includes a pointed apex at the top thereof.

REFERENCES:
patent: 6371838 (2002-04-01), Holzapfel
patent: 6419574 (2002-07-01), Takahashi et al.
patent: 6439986 (2002-08-01), Myoung et al.
patent: 6488570 (2002-12-01), James et al.

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