Polishing pad conditioning apparatus for wafer planarization pro

Details Polishing pad conditioning apparatus for wafer planarization pro Polishing pad conditioning apparatus for wafer planarization pro

1992-09-24

1993-06-08

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

511313, 51237R, 51317, 51325, 51263, 51209DL, B24B 2900

Patent

active

052168433

ABSTRACT:
An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.

REFERENCES:
patent: 2826009 (1958-03-01), Shurson
patent: 4839993 (1989-06-01), Masuko et al.

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