Polishing pad conditioning

Details Polishing pad conditioning Polishing pad conditioning

2005-12-20

2005-12-20

Nguyen, George (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S444000, C451S070000, C451S072000

Reexamination Certificate

active

06976907

ABSTRACT:
An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers is provided which includes a control arm configured to extend at least partially over a polishing pad. The apparatus also includes at least one cylindrical conditioning piece coupled to the control arm where the control arm is configured to apply the at least one cylindrical conditioning piece to the polishing pad.

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