Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2006-04-25
2006-04-25
Nguyen, George (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S072000, C451S057000, C451S443000, C451S444000, C451S464000
Reexamination Certificate
active
07033253
ABSTRACT:
Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support. The conditioner can include a first portion (e.g., an abrasive portion) having a first hardness and being positioned to contact a polishing pad carried by the support, and a second portion (e.g., a brush portion) having a second hardness less than the first hardness and being positioned proximate to the first portion.
REFERENCES:
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5245796 (1993-09-01), Miller et al.
patent: RE34425 (1993-11-01), Schultz
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5449314 (1995-09-01), Meikle et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5533924 (1996-07-01), Stroupe et al.
patent: 5540810 (1996-07-01), Sandhu et al.
patent: 5616069 (1997-04-01), Walker et al.
patent: 5618381 (1997-04-01), Doan et al.
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5645682 (1997-07-01), Skrovan
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5658190 (1997-08-01), Wright et al.
patent: 5664988 (1997-09-01), Stroupe et al.
patent: 5679065 (1997-10-01), Henderson
patent: 5679169 (1997-10-01), Gonzales et al.
patent: 5702292 (1997-12-01), Brunelli et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5747386 (1998-05-01), Moore
patent: 5779522 (1998-07-01), Walker et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5792709 (1998-08-01), Robinson et al.
patent: 5795495 (1998-08-01), Meikle
patent: 5801066 (1998-09-01), Meikle
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5830806 (1998-11-01), Hudson et al.
patent: 5833519 (1998-11-01), Moore
patent: 5846336 (1998-12-01), Skrovan
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5868896 (1999-02-01), Robinson et al.
patent: 5879226 (1999-03-01), Robinson
patent: 5882248 (1999-03-01), Wright et al.
patent: 5893754 (1999-04-01), Robinson et al.
patent: 5894852 (1999-04-01), Gonzales et al.
patent: 5895550 (1999-04-01), Andreas
patent: 5902173 (1999-05-01), Tanaka
patent: 5904615 (1999-05-01), Jeong et al.
patent: 5910043 (1999-06-01), Manzonie et al.
patent: 5934980 (1999-08-01), Koos et al.
patent: 5945347 (1999-08-01), Wright
patent: 5954912 (1999-09-01), Moore
patent: 5967030 (1999-10-01), Blalock
patent: 5972792 (1999-10-01), Hudson
patent: 5975994 (1999-11-01), Sandhu et al.
patent: 5980363 (1999-11-01), Meikle et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 5994224 (1999-11-01), Sandhu et al.
patent: 5997384 (1999-12-01), Blalock
patent: 6004196 (1999-12-01), Doan et al.
patent: 6007406 (1999-12-01), Custer et al.
patent: 6022266 (2000-02-01), Bullard et al.
patent: 6039633 (2000-03-01), Chopra
patent: 6040245 (2000-03-01), Sandhu et al.
patent: 6054015 (2000-04-01), Brunelli et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6074286 (2000-06-01), Ball
patent: 6083085 (2000-07-01), Lankford
patent: 6110820 (2000-08-01), Sandhu et al.
patent: 6116988 (2000-09-01), Ball
patent: 6120354 (2000-09-01), Koos et al.
patent: 6135856 (2000-10-01), Tjaden et al.
patent: 6139402 (2000-10-01), Moore
patent: 6143123 (2000-11-01), Robinson et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6152808 (2000-11-01), Moore
patent: 6152813 (2000-11-01), Suzuki
patent: 6162112 (2000-12-01), Miyazaki et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6187681 (2001-02-01), Moore
patent: 6191037 (2001-02-01), Robinson et al.
patent: 6193588 (2001-02-01), Carlson et al.
patent: 6196899 (2001-03-01), Chopra et al.
patent: 6200196 (2001-03-01), Custer et al.
patent: 6200901 (2001-03-01), Hudson et al.
patent: 6203404 (2001-03-01), Joslyn et al.
patent: 6203413 (2001-03-01), Skrovan
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6206757 (2001-03-01), Custer et al.
patent: 6206760 (2001-03-01), Chang et al.
patent: 6210257 (2001-04-01), Carlson
patent: 6213845 (2001-04-01), Elledge
patent: 6213856 (2001-04-01), Cho et al.
patent: 6218316 (2001-04-01), Marsh
patent: 6220934 (2001-04-01), Sharples et al.
patent: 6227955 (2001-05-01), Custer et al.
patent: 6234874 (2001-05-01), Ball
patent: 6234877 (2001-05-01), Koos et al.
patent: 6234878 (2001-05-01), Moore
patent: 6234883 (2001-05-01), Berman et al.
patent: 6237483 (2001-05-01), Blalock
patent: 6238270 (2001-05-01), Robinson
patent: 6241587 (2001-06-01), Drill et al.
patent: 6244944 (2001-06-01), Elledge
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6251785 (2001-06-01), Wright
patent: 6261151 (2001-07-01), Sandhu et al.
patent: 6261163 (2001-07-01), Walker et al.
patent: 6267650 (2001-07-01), Hembree
patent: 6273101 (2001-08-01), Gonzales et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6273796 (2001-08-01), Moore
patent: 6273800 (2001-08-01), Walker et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6302771 (2001-10-01), Liu et al.
patent: 6306008 (2001-10-01), Moore
patent: 6306012 (2001-10-01), Sabde
patent: 6306014 (2001-10-01), Walker et al.
patent: 6306768 (2001-10-01), Klein
patent: 6309433 (2001-10-01), Kinoshita
patent: 6312558 (2001-11-01), Moore
patent: 6328632 (2001-12-01), Chopra
patent: 6331136 (2001-12-01), Bass et al.
patent: 6331139 (2001-12-01), Walker et al.
patent: 6331488 (2001-12-01), Doan et al.
patent: 6343977 (2002-02-01), Peng et al.
patent: 6350180 (2002-02-01), Southwick
patent: 6350691 (2002-02-01), Lankford
patent: 6352466 (2002-03-01), Moore
patent: 6352470 (2002-03-01), Elledge
patent: 6354923 (2002-03-01), Lankford
patent: 6354930 (2002-03-01), Moore
patent: 6358122 (2002-03-01), Sabde et al.
patent: 6358127 (2002-03-01), Carlson et al.
patent: 6358129 (2002-03-01), Dow
patent: 6361411 (2002-03-01), Chopra et al.
patent: 6361413 (2002-03-01), Skrovan
patent: 6361417 (2002-03-01), Walker et al.
patent: 6364757 (2002-04-01), Moore
patent: 6368190 (2002-04-01), Easter et al.
patent: 6368193 (2002-04-01), Carlson et al.
patent: 6368194 (2002-04-01), Sharples et al.
patent: 6368197 (2002-04-01), Elledge
patent: 6371836 (2002-04-01), Brown et al.
patent: 6376381 (2002-04-01), Sabde
patent: 6383934 (2002-05-01), Sabde et al.
patent: 6387289 (2002-05-01), Wright
patent: 6395620 (2002-05-01), Pan et al.
patent: 6402884 (2002-06-01), Robinson et al.
patent: 6428386 (2002-08-01), Bartlett
patent: 6447369 (2002-09-01), Moore
patent: 6498101 (2002-12-01), Wang
patent: 6500054 (2002-12-01), Ma et al.
patent: 6511576 (2003-01-01), Klein
patent: 6517416 (2003-02-01), Crevasse et al.
patent: 6520834 (2003-02-01), Marshall
patent: 6533893 (2003-03-01), Sabde et al.
patent: 6666749 (2003-03-01), Taylor
patent: 6547640 (2003-04-01), Hofmann
patent: 6548407 (2003-04-01), Chopra et al.
patent: 6579799 (2003-06-01), Chopra et al.
patent: 6592443 (2003-07-01), Kramer et al.
patent: 6609947 (2003-08-01), Moore
patent: 6623329 (2003-09-01), Moore
patent: 6640816 (2003-11-01), Gonzales et al.
patent: 6652764 (2003-11-01), Blalock
patent: 6695680 (2004-02-01), Choi et al.
patent: 2003/0190874 (2003-10-01), So
Kondo, Seiichi, et al., “Abrasive-Free Polishing for Copper Damascene Interconnection,” Journal of Electrochemical Society, vol. 147, No. 10, pp. 3907-3913, The Electrochemical Society, Inc., 2000.
Micro)n Technology, Inc.
Nguyen George
Perkins Coie LLP
LandOfFree
Polishing pad conditioners having abrasives and brush... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing pad conditioners having abrasives and brush..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad conditioners having abrasives and brush... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3593083