Polishing pad conditioner and monitoring method therefor

Details Polishing pad conditioner and monitoring method therefor Polishing pad conditioner and monitoring method therefor

2006-06-13

2006-06-13

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S005000, C451S054000, C451S285000, C015S021100, C134S032000

Reexamination Certificate

active

07059939

ABSTRACT:
A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one sensor disposed on the transverse beam detects deflection of the transverse beam.

REFERENCES:
patent: 5975994 (1999-11-01), Sandhu et al.
patent: 6146241 (2000-11-01), Lee et al.
patent: 6306008 (2001-10-01), Moore
patent: 6524959 (2003-02-01), Lu et al.
patent: 6695680 (2004-02-01), Choi et al.
patent: 6699107 (2004-03-01), Marxsen et al.

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