Abrading – Flexible-member tool – per se – Interrupted or composite work face
Reexamination Certificate
2005-05-31
2005-05-31
Rachuba, M. (Department: 3723)
Abrading
Flexible-member tool, per se
Interrupted or composite work face
C451S539000
Reexamination Certificate
active
06899612
ABSTRACT:
Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R≧60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A10≦0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.
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Biederman Blake T.
Rachuba M.
Rohm and Haas Electronic Materials CMP Holdings Inc.
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