Polishing pad and methods relating thereto

Details Polishing pad and methods relating thereto Polishing pad and methods relating thereto

1998-02-10

2000-02-08

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

51298, 451 56, 451 58, 451 59, 451 72, 451527, 451550, B24B 100

Patent

active

060222646

ABSTRACT:
A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.

REFERENCES:
patent: 4788798 (1988-12-01), DeFranco et al.
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5304223 (1994-04-01), Peiper et al.
patent: 5435816 (1995-07-01), Spurgeon et al.
patent: 5527368 (1996-06-01), Supkis et al.
patent: 5722106 (1998-03-01), Masterman et al.

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