Polishing pad and method of producing same

Details Polishing pad and method of producing same Polishing pad and method of producing same

2007-07-03

2007-07-03

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S530000, C451S533000

Reexamination Certificate

active

11010199

ABSTRACT:
A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.

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patent: 2001-179607 (2001-07-01), None
patent: 2002-324770 (2002-11-01), None
patent: 2003-48151 (2003-02-01), None
patent: WO 01/91971 (2001-06-01), None

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