Polishing pad and method for polishing semiconductor wafers

Details Polishing pad and method for polishing semiconductor wafers Polishing pad and method for polishing semiconductor wafers

1992-04-28

1994-02-22

Rachuba, M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51395, B24D 1100

Patent

active

052876632

ABSTRACT:
A polishing pad and a method for polishing semiconductor wafers. The polishing pad includes a polishing layer and a rigid layer. The rigid layer adjacent the polishing layer imparts a controlled rigidity to the polishing layer. The resilient layer adjacent the rigid layer provides substantially uniform pressure to the rigid layer. During operation, the rigid layer and the resilient layer apply an elastic flexure pressure to the polishing layer to induce a controlled flex in the polishing layer to conform to the global topography of the wafer surface while maintaining a controlled rigidity over the local topography of the wafer surface.

REFERENCES:
patent: 3863395 (1975-02-01), Brown
patent: 4450652 (1984-05-01), Walsh
patent: 5020283 (1991-06-01), Tuttle

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