Polishing pad, and method and apparatus for polishing

Details Polishing pad, and method and apparatus for polishing Polishing pad, and method and apparatus for polishing

2005-10-11

2005-10-11

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S526000, C451S533000, C051S295000, C051S298000, C438S691000

Reexamination Certificate

active

06953388

ABSTRACT:
A polishing pad characterized by having a mechanism for supplying water to the plane of the polishing pad in contact with the article to be polished, in particular, in case the mechanism comprises a domain structure having an area of 1×10−6m2or smaller, reduces the generation of scratches and the dust adhesion on the surface of the article to be polished, while increasing polishing rate at low dishing and erosion; hence, the product is applicable to the field of surface polishing of semiconductor thin films.

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