Polishing pad and apparatus for polishing a semiconductor wafer

Details Polishing pad and apparatus for polishing a semiconductor wafer Polishing pad and apparatus for polishing a semiconductor wafer

1997-11-26

2000-06-20

Eley, Timothy V.

Abrading

Machine

Rotary tool

451287, 451533, 451550, B24B 500

Patent

active

060771534

ABSTRACT:
An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.

REFERENCES:
patent: 5020283 (1991-06-01), Tuttle
patent: 5177908 (1993-01-01), Tuttle
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5839947 (1998-11-01), Kimura et al.
patent: 5851846 (1998-12-01), Matsui et al.
patent: 5860851 (1999-01-01), Beppu et al.
patent: 5876269 (1999-03-01), Torii
patent: 5879220 (1999-03-01), Hasegawa et al.

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