Polishing pad and a method for making a polishing pad with coval

Details Polishing pad and a method for making a polishing pad with coval Polishing pad and a method for making a polishing pad with coval

1998-08-20

1999-08-17

Jones, Deborah

Abrasive tool making process, material, or composition

With hydrocarbon

51293, 51298, 451 41, B24B 704

Patent

active

059388013

ABSTRACT:
The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers, and a method for making the polishing pad. The polishing pad has a body, molecular bonding links, and abrasive particles dispersed substantially uniformly throughout the body. The body is made from a polymeric matrix material and the molecular bonding links are covalently bonded to the matrix material. Substantially all of the abrasive particles are covalently bonded to at least one molecular bonding link. The molecular bonding links securely affix the abrasive particles to the matrix material to enhance the uniformity of the distribution of the abrasive particles throughout the pad and to substantially prevent the abrasive particles from breaking away from the pad.

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