Polishing pad

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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Details

C451S041000, C451S526000, C451S527000, C451S533000

Reexamination Certificate

active

07874894

ABSTRACT:
A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. The polishing pad includes at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region; the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.

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Chinese Office Action dated Feb. 26, 2010, directed towards counterpart Chinese Application No. 200780017751.2; 10 pages.
Taiwanese Office Action dated Jan. 19, 2010, directed towards corresponding Taiwan Patent Application No. 096117369; 10 pages.

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