Polishing pad

Details Polishing pad Polishing pad

2011-04-19

2011-04-19

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S041000, C451S526000, C451S527000

Reexamination Certificate

active

07927183

ABSTRACT:
A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.

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